COM Express, Type 6, Xeon E-2276ML, DDR4, 0°C~+60°C

Kod produktu: conga-TS370/E-2276ML

Cechy produktu:

  • COM Express Type 6 Basic module
  • Intel® Xeon® E-2276ML 6-core processor with 2.0GHz up to 4.2GHz turbo boost, 12MB Intel® Smart Cache
  • Intel® UHD Graphics P630
  • dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh)
  • Chipset CM246
Ordering information
P/N Article Description
049110 TS370/E-2276ML COM Express Type 6 Basic module based on Intel® Xeon® E-2276ML 6-core processor with 2.0GHz up to 4.2GHz turbo boost, 12MB Intel® Smart Cache, Intel® UHD Graphics P630 and dual channel DDR4 2666 MT/s ECC memory interface (formerly Coffee Lake-H Refresh). Chipset CM246.

 

Optional accessories
P/N Article Description
045930 TS170/CSA-HP-B Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
045931 TS170/CSA-HP-T Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
045932 TS170/CSP-HP-B Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
045933 TS170/CSP-HP-T Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
045934 TS170/HSP-HP-B Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
045935 TS170/HSP-HP0-T Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread.
065810 TEVAL2 Evaluation Carrier Board for COM Express Type 6 modules.
065830 IT6/COMe Carrier Standard Mini-ITX carrier board for COM Express Type 6 modules.
065840 IT6/IO Shield IO shield for conga-IT6/COMe Carrier board with standard Mini-ITX height.
067780 DDR4-SODIMM-2666 (4GB) DDR4 SODIMM memory module with 2666 MT/s and 4GB RAM
067781 DDR4-SODIMM-2666 (8GB) DDR4 SODIMM memory module with 2666 MT/s and 8GB RAM
067782 DDR4-SODIMM-2666 (16GB) DDR4 SODIMM memory module with 2666 MT/s and 16GB RAM
068806 DDR4-SODIMM-2666 (32GB) DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM
067783 DDR4-SODIMM-2666 ECC (4GB) DDR4 ECC SODIMM memory module with 2666 MT/s and 4GB RAM
067784 DDR4-SODIMM-2666 ECC (8GB) DDR4 ECC SODIMM memory module with 2666 MT/s and 8GB RAM
067785 DDR4-SODIMM-2666 ECC (16GB) DDR4 ECC SODIMM memory module with 2666 MT/s and 16GB RAM
068805 DDR4-SODIMM-2666 ECC (32GB) DDR4 ECC SODIMM memory module with 2666 MT/s and 32GB RAM
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