COM Express, Type 6, Xeon E3-1558L V5, DDR4, 0°C~+60°C
Kod produktu: conga-TS170/E3-1558LV5
Cechy produktu:
- COM Express Type 6 Basic module
- Skylake-H Intel Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache
- GT3e graphics
- 2133MT/s dual channel DDR4 memory interface
- Chipset CM236 with ECC memory support
| Ordering information | ||
| P/N | Article | Description |
| 045914 | TS170/E3-1558LV5 | COM Express Type 6 Basic module with Skylake-H Intel Xeon® E3-1558L V5 quad core processor with 1.9GHz up to 3.3GHz, 8MB L2 cache, GT3e graphics and 2133MT/s dual channel DDR4 memory interface, Chipset CM236 with ECC memory support |
| Optional accessories | ||
| P/N | Article | Description |
| 045930 | TS170/CSA-HP-B | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 045931 | TS170/CSA-HP-T | Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 045932 | TS170/CSP-HP-B | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 045933 | TS170/CSP-HP-T | Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread. |
| 045934 | TS170/HSP-HP-B | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole. |
| 045935 | TS170/HSP-HP-T | Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread. |
| 065810 | TEVAL2 | Evaluation Carrier Board for COM Express Type 6 modules. |
| 065830 | IT6/COMe Carrier | Standard Mini-ITX carrier board for COM Express Type 6 modules. |
| 065840 | IT6/IO Shield | IO shield for conga-IT6/COMe Carrier board with standard Mini-ITX height. |
| 068790 | DDR4-SODIMM-2400 (4GB) | DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM |
| 068791 | DDR4-SODIMM-2400 (8GB) | DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM |
| 068792 | DDR4-SODIMM-2400 (16GB) | DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM |
| 068795 | DDR4-SODIMM-2400 ECC (4GB) | DDR4 ECC SODIMM memory module with 2400 MT/s and 4GB RAM |
| 068796 | DDR4-SODIMM-2400 ECC (8GB) | DDR4 ECC SODIMM memory module with 2400 MT/s and 8GB RAM |
| 068797 | DDR4-SODIMM-2400 ECC (16GB) | DDR4 ECC SODIMM memory module with 2400 MT/s and 16GB RAM |
| Krzysztof Świat | Kierownik Działu Sprzedaży | 12 323 62 25 | 502 899 046 | |
| Grzegorz Kowalczyk | Senior Key Account Manager | 12 323 62 21 | 502 898 801 | |
| Marcin Obarzanek | Senior Account Manager | 12 323 62 26 | 502 899 002 | |
| Andrzej Jamrozik | Account Manager | 12 323 62 22 | 502 899 048 | |
| Justyna Undas | Inżynier Sprzedaży | 12 323 62 31 |
