Qseven, NXP i.MX 8M Plus, 4GB DDR4, 16GB eMMC, -40°C~85°C
Kod produktu: conga-QMX8-Plus/i-QC-NPU-4G eMMC16
Cechy produktu:
- low-power 14nm NXP i.MX 8M Plus Quad
- 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU
- 4GB onboard LPDDR4 memory
- 16GB onboard eMMC
- Industrial grade temperature range from -40°C to 85°C
| Ordering information | ||
| P/N | Article | Description |
| 061620 | conga-QMX8-Plus/i-QC-NPU-4G eMMC16 | Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C. |
| Optional accessories | ||
| P/N | Article | Description |
| 61650 | conga-QMX8-Plus/HSP-T | Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are 2.5mm thread. |
| 61650 | conga-QMX8-Plus/HSP-B | Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. |
| 61650 | conga-QMX8-Plus/CSP-T | Passive cooling for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are 2.5mm thread. |
| 61650 | conga-QMX8-Plus/CSP-B | Passive cooling for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. |
| 007005 | conga-QEVAL/Qseven 2.0 ARM | Evaluation carrier board for Qseven ARM modules |
| Krzysztof Świat | Kierownik Działu Sprzedaży | 12 323 62 25 | 502 899 046 | |
| Grzegorz Kowalczyk | Senior Key Account Manager | 12 323 62 21 | 502 898 801 | |
| Marcin Obarzanek | Senior Account Manager | 12 323 62 26 | 502 899 002 | |
| Andrzej Jamrozik | Account Manager | 12 323 62 22 | 502 899 048 | |
| Justyna Undas | Inżynier Sprzedaży | 12 323 62 31 |
