COM Express, Type 6, AMD V2718, DDR4, 0°C~+60°C
Kod produktu: conga-TCV2/V2718
Cechy produktu:
- COM Express Type 6 Compact module
- AMD Embedded Ryzen V2718 8-core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache
- Radeon Vega7 Graphics with 7 CU
- dual channel DDR4 3200 MT/s memory interface with ECC support
- Commercial temperature range
| Ordering information | ||
| P/N | Article | Description |
| 050502 | TCV2/V2718 | COM Express Type 6 Compact module based on AMD Embedded Ryzen V2718 8-core processor with 1.7GHz up to 4.15GHz turbo boost, 4MB L2 cache, Radeon Vega7 Graphics with 7 CU and dual channel DDR4 3200 MT/s memory interface with ECC support. Commercial temperature range. |
| Optional accessories | ||
| P/N | Article | Description |
| 050550 | TCV2/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050551 | TCV2/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050552 | TCV2/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050553 | TCV2/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TCV2 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050554 | TCV2/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050555 | TCV2/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TCV2 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 065810 | TEVAL2 | Evaluation Carrier Board for COM Express Type 6 modules. |
| 065830 | IT6/COMe Carrier | Standard Mini-ITX carrier board for COM Express Type 6 modules. |
| 065840 | IT6/IO Shield | IO shield for conga-IT6/COMe Carrier board with standard Mini-ITX height. |
| 068793 | DDR4-SODIMM-3200 (4GB) | DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068794 | DDR4-SODIMM-3200 (8GB) | DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068798 | DDR4-SODIMM-3200 (16GB) | DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM |
| 068736 | DDR4-SODIMM-3200 ECC (4GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068737 | DDR4-SODIMM-3200 ECC (8GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068738 | DDR4-SODIMM-3200 ECC (16GB) | DDR4 ECC SODIMM memory module with 3200 MT/s and 16GB RAM |
| Krzysztof Świat | Kierownik Działu Sprzedaży | 12 323 62 25 | 502 899 046 | |
| Grzegorz Kowalczyk | Senior Key Account Manager | 12 323 62 21 | 502 898 801 | |
| Marcin Obarzanek | Senior Account Manager | 12 323 62 26 | 502 899 002 | |
| Andrzej Jamrozik | Account Manager | 12 323 62 22 | 502 899 048 | |
| Justyna Undas | Inżynier Sprzedaży | 12 323 62 31 |
