COM Express, Type 6, i3-8145UE, DDR4, 0°C~+60°C
Kod produktu: conga-TC370/i3-8145UE
Cechy produktu:
- COM Express Type 6 Compact module
- Intel® Core™ i3-8145UE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 4MB L2 cache
- Intel® UHD Graphics 620
- dual channel DDR4 2400 MT/s memory interface (Intel Whiskey Lake)
| Ordering information | ||
| P/N | Article | Description |
| 048802 | TC370/i3-8145UE | COM Express Type 6 Compact module based on Intel® Core™ i3-8145UE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 4MB L2 cache, Intel® UHD Graphics 620 and dual channel DDR4 2400 MT/s memory interface (Intel Whiskey Lake). |
| Optional accessories | ||
| P/N | Article | Description |
| 048850 | TC370/CSA-HP-B | Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048851 | TC370/CSA-HP-T | Standard active cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes, 25.5mm overall cooling height and integrated 12V fan. Threaded mounting with threaded standoffs M2.5. |
| 048852 | TC370/CSP-HP-B | Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048853 | TC370/CSP-HP-T | Standard passive cooling solution for COM Express Compact modules conga-TC370 with integrated heat pipes and 24.3mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 048854 | TC370/HSP-HP-B | Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Through hole mounting with bore hole standoffs Ø2.7mm. |
| 048855 | TC370/HSP-HP-T | Standard heatspreader for COM Express Compact modules conga-TC370 with integrated heat pipes and 11mm overall cooling height. Threaded mounting with threaded standoffs M2.5. |
| 065810 | TEVAL2 | Evaluation Carrier Board for COM Express Type 6 modules. |
| 065830 | IT6/COMe Carrier | Standard Mini-ITX carrier board for COM Express Type 6 modules. |
| 065840 | IT6/IO Shield | IO shield for conga-IT6/COMe Carrier board with standard Mini-ITX height. |
| 067780 | DDR4-SODIMM-2666 (4GB) | DDR4 SODIMM memory module with 2666 MT/s and 4GB RAM |
| 067781 | DDR4-SODIMM-2666 (8GB) | DDR4 SODIMM memory module with 2666 MT/s and 8GB RAM |
| 067782 | DDR4-SODIMM-2666 (16GB) | DDR4 SODIMM memory module with 2666 MT/s and 16GB RAM |
| 068806 | DDR4-SODIMM-2666 (32GB) | DDR4 SODIMM memory module with 2666 MT/s and 32GB RAM |
| Krzysztof Świat | Kierownik Działu Sprzedaży | 12 323 62 25 | 502 899 046 | |
| Grzegorz Kowalczyk | Senior Key Account Manager | 12 323 62 21 | 502 898 801 | |
| Marcin Obarzanek | Senior Account Manager | 12 323 62 26 | 502 899 002 | |
| Andrzej Jamrozik | Account Manager | 12 323 62 22 | 502 899 048 | |
| Justyna Undas | Inżynier Sprzedaży | 12 323 62 31 |
