COM Express, Type 6, Xeon E3-1505M V5, DDR4, 0°C~+60°C

Kod produktu: conga-TS170/E3-1505MV5

Cechy produktu:

  • COM Express Type 6 Basic module
  • Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB Intel® Smart Cache
  • GT2 graphics
  • 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H)
  • Chipset CM236 with ECC memory support
Ordering information
P/N Article Description
045906 TS170/E3-1505MV5 COM Express Type 6 Basic module with Intel® Xeon® E3-1505M V5 quad core processor with 2.8GHz up to 3.7GHz, 8MB Intel® Smart Cache, GT2 graphics and 2133MT/s dual channel DDR4 memory interface (Intel Skylake-H). Chipset CM236 with ECC memory support.

 

Optional accessories
P/N Article Description
045930 TS170/CSA-HP-B Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole.
045931 TS170/CSA-HP-T Standard active cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins, 20mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread.
045932 TS170/CSP-HP-B Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are with 2.7mm bore hole.
045933 TS170/CSP-HP-T Standard passive cooling solution for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes, 15mm silver fins and 20mm overall heat sink height. All standoffs are M2.5mm thread.
045934 TS170/HSP-HP-B Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are with 2.7mm bore hole.
045935 TS170/HSP-HP-T Standard heatspreader for high performance COM Express modules conga-TS170/TS175/TS370 with integrated heat pipes. All standoffs are M2.5mm thread.
065810 TEVAL2 Evaluation Carrier Board for COM Express Type 6 modules.
065830 IT6/COMe Carrier Standard Mini-ITX carrier board for COM Express Type 6 modules.
065840 IT6/IO Shield IO shield for conga-IT6/COMe Carrier board with standard Mini-ITX height.
068790 DDR4-SODIMM-2400 (4GB) DDR4 SODIMM memory module with 2400 MT/s and 4GB RAM
068791 DDR4-SODIMM-2400 (8GB) DDR4 SODIMM memory module with 2400 MT/s and 8GB RAM
068792 DDR4-SODIMM-2400 (16GB) DDR4 SODIMM memory module with 2400 MT/s and 16GB RAM
068795 DDR4-SODIMM-2400 ECC (4GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 4GB RAM
068796 DDR4-SODIMM-2400 ECC (8GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 8GB RAM
068797 DDR4-SODIMM-2400 ECC (16GB) DDR4 ECC SODIMM memory module with 2400 MT/s and 16GB RAM