Cechy produktu:
- low-power 14nm NXP i.MX 8M Plus Quad
- 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU
- 4GB onboard LPDDR4 memory
- 16GB onboard eMMC
- Industrial grade temperature range from -40°C to 85°C
Ordering information | ||
P/N | Article | Description |
061620 | conga-QMX8-Plus/i-QC-NPU-4G eMMC16 | Qseven module with low-power 14nm NXP i.MX 8M Plus Quad processor. Features 4x ARM® Cortex®-A53 @ 1.6GHz +1x ARM® Cortex®-M7 + NPU, 4GB onboard LPDDR4 memory and 16GB onboard eMMC. Industrial grade temperature range from -40°C to 85°C. |
Optional accessories | ||
P/N | Article | Description |
61650 | conga-QMX8-Plus/HSP-T | Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are 2.5mm thread. |
61650 | conga-QMX8-Plus/HSP-B | Standard heatspreader for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. |
61650 | conga-QMX8-Plus/CSP-T | Passive cooling for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are 2.5mm thread. |
61650 | conga-QMX8-Plus/CSP-B | Passive cooling for Qseven module conga-QMX8-Plus with NXP i.MX 8M Plus ARM processor. All standoffs are with 2.7mm bore hole. |
007005 | conga-QEVAL/Qseven 2.0 ARM | Evaluation carrier board for Qseven ARM modules |