COM Express, Type 6, i3-1115GRE, DDR4, -40°C~+85°C
Kod produktu: conga-TC570/i3-1115GRE
Cechy produktu:
- COM Express Type 6 Compact module
- Intel® Core™ i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache
- Intel® Iris® Xe Graphics with 48EU
- dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake)
- Industrial temperature range
| Ordering information | ||
| P/N | Article | Description |
| 050312 | TC570/i3-1115GRE | COM Express Type 6 Compact module based on Intel® Core™ i3-1115GRE 2-core processor with 2.2GHz up to 3.9GHz turbo boost, 6MB cache, Intel® Iris® Xe Graphics with 48EU and dual channel DDR4 3200 MT/s memory interface (Intel Tiger Lake). Industrial temperature range. |
| Optional accessories | ||
| P/N | Article | Description |
| 050350 | TC570/CSA-HP-B | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are with 2.7mm bore hole. |
| 050351 | TC570/CSA-HP-T | Standard active cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 25.5mm overall heat sink height and integrated 12V fan. All standoffs are M2.5mm thread. |
| 050352 | TC570/CSP-HP-B | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050353 | TC570/CSP-HP-T | Standard passive cooling solution for high performance COM Express module conga-TC570 with integrated heat pipes, 24.3mm overall heat sink height. All standoffs are M2.5mm thread. |
| 050354 | TC570/HSP-HP-B | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are with 2.7mm bore hole. |
| 050355 | TC570/HSP-HP-T | Standard heatspreader for high performance COM Express module conga-TC570 with integrated heat pipes, 11mm overall heat sink height. All standoffs are M2.5mm thread. |
| 065810 | TEVAL2 | Evaluation Carrier Board for COM Express Type 6 modules. |
| 065830 | IT6/COMe Carrier | Standard Mini-ITX carrier board for COM Express Type 6 modules. |
| 065840 | IT6/IO Shield | IO shield for conga-IT6/COMe Carrier board with standard Mini-ITX height. |
| 068793 | DDR4-SODIMM-3200 (4GB) | DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068794 | DDR4-SODIMM-3200 (8GB) | DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068798 | DDR4-SODIMM-3200 (16GB) | DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM |
| 068825 | DDR4-SODIMM-3200 (4GB) / i-temp | Industrial DDR4 SODIMM memory module with 3200 MT/s and 4GB RAM |
| 068826 | DDR4-SODIMM-3200 (8GB) / i-temp | Industrial DDR4 SODIMM memory module with 3200 MT/s and 8GB RAM |
| 068827 | DDR4-SODIMM-3200 (16GB) / i-temp | Industrial DDR4 SODIMM memory module with 3200 MT/s and 16GB RAM |
| Krzysztof Świat | Kierownik Działu Sprzedaży | 12 323 62 25 | 502 899 046 | |
| Grzegorz Kowalczyk | Senior Key Account Manager | 12 323 62 21 | 502 898 801 | |
| Marcin Obarzanek | Senior Account Manager | 12 323 62 26 | 502 899 002 | |
| Andrzej Jamrozik | Account Manager | 12 323 62 22 | 502 899 048 | |
| Justyna Undas | Inżynier Sprzedaży | 12 323 62 31 |
